PART |
Description |
Maker |
449-10-208 449-10-208-00-560000 |
Interconnect Header .100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
449-10-210 449-10-210-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
349-10-103-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
449-10-206-00-560000 |
Interconnect Header .100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
860-10-050-10-002000 |
Interconnect Header 1mm Grid; Straight Pin Header
|
Mill-Max Mfg. Corp.
|
480-90-202-00-001000 480-90-264-00-001000 450-90-2 |
HEADER STRIPS .100隆卤 Grid Solder Tail Double Row HEADER STRIPS .100 Grid Solder Tail Double Row HEADER STRIPS .100?/a> Grid Solder Tail Double Row TWO PART BOARD CONNECTOR
|
Mill-Max Mfg. Corp. MILL-MAX MFG CORP
|
0901200843 90120-0843 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 3 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating MOLEX Connector
|
Molex Electronics Ltd.
|
0901200960 90120-0960 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 40 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
0918143118 91814-3118 |
2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header 2.54mm (.100) Pitch C-Grid III?/a> Dual Row Right Angle Shrouded Header 2.54mm (.100") Pitch C-Grid III垄芒 Dual Row Right Angle Shrouded Header
|
Molex Electronics Ltd.
|
817-22-072-30 |
Interconnect Header Spring-Loaded Header Double Row Surface Mount
|
Maxim Integrated Products Mill-Max Mfg. Corp.
|
829-22-018-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|